Problem size reduction in thermal models

D. de Cogan

Research output: Contribution to conferenceOther

Abstract

As computing power increases there is a natural tendency to use it to tackle larger problems in greater detail. The perfect description of a semiconductor device may provide an exact measure of the power dissipation. But when it is realised that the chip is on a header, encapsulated in a package which is attached to one of many circuit boards within a cabinet, etc., then it is time to stand back and look at the forest and ignore the stomata on the leaves on the trees. This paper provides a tour of the problem, highlights some recent developments and suggests areas which might be usefully investigated in the future.
Original languageEnglish
Pages7/1-7/4
DOIs
Publication statusPublished - 1997
EventIEE Colloquium on Modelling and Simulation for Thermal Management (Digest No. 1997/043) -
Duration: 1 Jan 1997 → …

Conference

ConferenceIEE Colloquium on Modelling and Simulation for Thermal Management (Digest No. 1997/043)
Period1/01/97 → …

Cite this