Problem size reduction in thermal models

D. de Cogan

doi:10.1049/ic:19970272

Problem size reduction in thermal models

D. de Cogan

School of Computing Sciences

Research output: Contribution to conference › Other

Abstract

As computing power increases there is a natural tendency to use it to tackle larger problems in greater detail. The perfect description of a semiconductor device may provide an exact measure of the power dissipation. But when it is realised that the chip is on a header, encapsulated in a package which is attached to one of many circuit boards within a cabinet, etc., then it is time to stand back and look at the forest and ignore the stomata on the leaves on the trees. This paper provides a tour of the problem, highlights some recent developments and suggests areas which might be usefully investigated in the future.

Original language	English
Pages	7/1-7/4
DOIs	https://doi.org/10.1049/ic:19970272
Publication status	Published - 1997
Event	IEE Colloquium on Modelling and Simulation for Thermal Management (Digest No. 1997/043) - Duration: 1 Jan 1997 → …

Conference

Conference	IEE Colloquium on Modelling and Simulation for Thermal Management (Digest No. 1997/043)
Period	1/01/97 → …

Access to Document

10.1049/ic:19970272

Cite this

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AB - As computing power increases there is a natural tendency to use it to tackle larger problems in greater detail. The perfect description of a semiconductor device may provide an exact measure of the power dissipation. But when it is realised that the chip is on a header, encapsulated in a package which is attached to one of many circuit boards within a cabinet, etc., then it is time to stand back and look at the forest and ignore the stomata on the leaves on the trees. This paper provides a tour of the problem, highlights some recent developments and suggests areas which might be usefully investigated in the future.

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