Abstract
The heat transfer processes involved in the thermal management of electronic networks are complex. TLM (transmission line modelling) is an implementationally advantageous method of modelling heat transfer and related phenomena. The authors discuss the possibility and appropriateness of using the TLM technique to model aspects of heat dissipation in electronic networks. The following aspects of thermal effects in electronic networks are considered: modelling of heat transfer by conduction, convection and radiation, the incorporation of nonlinear thermal properties; the treatment of numerically stiff problems; modelling of forced air cooling; and modelling of changes of state
Original language | English |
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Pages | 1/1-1/4 |
Number of pages | 4 |
Publication status | Published - 1989 |
Event | IEE Colloquium on Computer Aided Design Tools for Thermal Management - London, United Kingdom Duration: 15 Dec 1989 → … |
Conference
Conference | IEE Colloquium on Computer Aided Design Tools for Thermal Management |
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Country/Territory | United Kingdom |
City | London |
Period | 15/12/89 → … |