Thermal Diffusivity of SPS Pressed Silicon Powders and the Potential for Using Bottom–Up Silicon Quantum Dots as a Starting Material

Shane P. Ashby; Tiezheng Bian; Huanpo Ning; Michael J. Reece; Yimin Chao

doi:10.1007/s11664-014-3599-y

Thermal Diffusivity of SPS Pressed Silicon Powders and the Potential for Using Bottom–Up Silicon Quantum Dots as a Starting Material

Shane P. Ashby, Tiezheng Bian, Huanpo Ning, Michael J. Reece, Yimin Chao

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Original language	English
Pages (from-to)	1931-1935
Number of pages	5
Journal	Journal of Electronic Materials
Volume	44
Issue number	6
Early online date	8 Jan 2015
DOIs	https://doi.org/10.1007/s11664-014-3599-y
Publication status	Published - Jun 2015

Keywords

Silicon
nanoparticles
thermoelectric
spark plasma sintering
thermal conductivity

Access to Document

10.1007/s11664-014-3599-y

Cite this

@article{a96df9f192d341a7b2431cd8b5d8642b,

title = "Thermal Diffusivity of SPS Pressed Silicon Powders and the Potential for Using Bottom–Up Silicon Quantum Dots as a Starting Material",

keywords = "Silicon, nanoparticles, thermoelectric, spark plasma sintering, thermal conductivity",

author = "Ashby, {Shane P.} and Tiezheng Bian and Huanpo Ning and Reece, {Michael J.} and Yimin Chao",

year = "2015",

month = jun,

doi = "10.1007/s11664-014-3599-y",

language = "English",

volume = "44",

pages = "1931--1935 ",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

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T1 - Thermal Diffusivity of SPS Pressed Silicon Powders and the Potential for Using Bottom–Up Silicon Quantum Dots as a Starting Material

AU - Ashby, Shane P.

AU - Bian, Tiezheng

AU - Ning, Huanpo

AU - Reece, Michael J.

AU - Chao, Yimin

PY - 2015/6

Y1 - 2015/6

KW - Silicon

KW - nanoparticles

KW - thermoelectric

KW - spark plasma sintering

KW - thermal conductivity

U2 - 10.1007/s11664-014-3599-y

DO - 10.1007/s11664-014-3599-y

M3 - Article

VL - 44

SP - 1931

EP - 1935

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 6

ER -