TLM modeling of solder joints in semiconductor devices

M. Henini; D. de Cogan

doi:10.1109/TCHMT.1987.1134746

TLM modeling of solder joints in semiconductor devices

M. Henini, D. de Cogan

School of Computing Sciences

Research output: Contribution to journal › Article › peer-review

Abstract

Transmission-line matrix (TLM) is an elegant technique for modeling heat flow in semiconductor devices. Unlike some other numerical methods a sense of the physical nature of the problem is retained and irregular boundaries, inhomogeneities, and temperature dependent thermal parameters can be easily incorporated. The inclusion of a layer of solder between a device and its PaCkage has a substantial influence on the temperature distribution. This theoretical paper investigates the effects of solder joint perfection and indicates the extent to which topographical methods such as infrared thermal imaging can give useful experimental results.

Original language	English
Pages (from-to)	440-445
Number of pages	6
Journal	IEEE Transactions on Components, Hybrids and Manufacturing Technology
Volume	10
Issue number	3
DOIs	https://doi.org/10.1109/TCHMT.1987.1134746
Publication status	Published - Sep 1987

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10.1109/TCHMT.1987.1134746

Cite this

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abstract = "Transmission-line matrix (TLM) is an elegant technique for modeling heat flow in semiconductor devices. Unlike some other numerical methods a sense of the physical nature of the problem is retained and irregular boundaries, inhomogeneities, and temperature dependent thermal parameters can be easily incorporated. The inclusion of a layer of solder between a device and its PaCkage has a substantial influence on the temperature distribution. This theoretical paper investigates the effects of solder joint perfection and indicates the extent to which topographical methods such as infrared thermal imaging can give useful experimental results.",

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AU - de Cogan, D.

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N2 - Transmission-line matrix (TLM) is an elegant technique for modeling heat flow in semiconductor devices. Unlike some other numerical methods a sense of the physical nature of the problem is retained and irregular boundaries, inhomogeneities, and temperature dependent thermal parameters can be easily incorporated. The inclusion of a layer of solder between a device and its PaCkage has a substantial influence on the temperature distribution. This theoretical paper investigates the effects of solder joint perfection and indicates the extent to which topographical methods such as infrared thermal imaging can give useful experimental results.

AB - Transmission-line matrix (TLM) is an elegant technique for modeling heat flow in semiconductor devices. Unlike some other numerical methods a sense of the physical nature of the problem is retained and irregular boundaries, inhomogeneities, and temperature dependent thermal parameters can be easily incorporated. The inclusion of a layer of solder between a device and its PaCkage has a substantial influence on the temperature distribution. This theoretical paper investigates the effects of solder joint perfection and indicates the extent to which topographical methods such as infrared thermal imaging can give useful experimental results.

U2 - 10.1109/TCHMT.1987.1134746

DO - 10.1109/TCHMT.1987.1134746

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JO - IEEE Transactions on Components, Hybrids and Manufacturing Technology

JF - IEEE Transactions on Components, Hybrids and Manufacturing Technology

SN - 0148-6411

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